Surface Temperature and Pressure Drop Simulation Analysis of Nanofluid Flow in Microchannel Heat Sink

Authors

  • Nurafiqah Mohd Alhata Department of Physics, Faculty of Applied Sciences and Technology (FAST), Universiti Tun Hussein Onn Malaysia (UTHM), Pagoh Branch Campus, Pagoh Higher Education Hub, Km 1, Jalan Panchor, 84600 Muar, Johor Darul Ta'zim, MALAYSIA https://orcid.org/0009-0002-6640-3657
  • Amira Saryati Ameruddin Department of Physics, Faculty of Applied Sciences and Technology (FAST), Universiti Tun Hussein Onn Malaysia (UTHM), Pagoh Branch Campus, Pagoh Higher Education Hub, Km 1, Jalan Panchor, 84600 Muar, Johor Darul Ta'zim, MALAYSIA
  • Rosmila Abdul-Kahar Department of Physics, Faculty of Applied Sciences and Technology (FAST), Universiti Tun Hussein Onn Malaysia (UTHM), Pagoh Branch Campus, Pagoh Higher Education Hub, Km 1, Jalan Panchor, 84600 Muar, Johor Darul Ta'zim, MALAYSIA
  • Mirza Basyir Rodhuan Department of Physics, Faculty of Applied Sciences and Technology (FAST), Universiti Tun Hussein Onn Malaysia (UTHM), Pagoh Branch Campus, Pagoh Higher Education Hub, Km 1, Jalan Panchor, 84600 Muar, Johor Darul Ta'zim, MALAYSIA https://orcid.org/0000-0002-8980-478X

DOI:

https://doi.org/10.22452/

Keywords:

Nanofluid, Heat transfer, Temperature, Pressure drop, Microchannel heat sink

Abstract

The increasing demand for high-performance electronic devices has driven the need more effective thermal management solutions. Standard air-cooling methods fall short when handling high heat flow rates. Among the most promising solutions is the Micro Channel Heat Sink (MCHS), specifically designed to address this challenge. To draw heat away from the chip, a cold liquid navigates intricate channels within the electronic system. The design of the heat sink profoundly influences crucial factors, such as microchannel area, heatsink size, channel width, height, and inlet/outlet diameters, each of which is affected differently by the heat sink's configuration. This study investigated heat transfer performance across various thicknesses, exploring nanoliquids, air, and water as cooling agents. After reviewing the setup steps, the ideal fluid performance for the given design is identified. Using COMSOL Multiphysics 5.5 software, a 3D model of a rectangular copper MCHS is created employing the finite element method. Results indicate that a 5 mm channel thickness using Aluminum oxide (Al2O3) nanofluids yields the most promising thickness based on the findings. Al2O3 exhibits outstanding performance, maintaining momentum even at lower temperatures. The influence of fluid flow velocity on the MCHS is reflected in the 5 mm channel thickness, significantly impacting the effective pressure drop. One avenue for potentially enhancing performance involves considering the aspect ratio of nanofluidic particles and exploring diverse materials such as iron and aluminum.

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Published

30-06-2026

Issue

Vol. 45 No. Sp1 (2026): Special Issue: FAST-UTHM GLOBAL NEXUS CONFERENCE 2024 - 9th International Conference on the Application of Science and Mathematics (SCIEMATHIC) 2024

Section

Special Issue - FAST-UTHM Global Nexus Conference 2024

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